NEXCOM aROK 5510hossein shatinezhadNovember 23, 2021December 13, 2021

NEXCOM aROK 5510

Intel® Core™ 8/9th Gen./Xeon® CPU with Rich Storage Powerful Platform for AI Application and Storage Server

aROK 5510, powerful and reliable Artificial Intelligent (AI) platform, is specially designed for the rolling stock applications, such as track obstacle inspection, traffic light, traffic sign recognition, pantograph inspection and highly-demanding on graphic performance. It is equipped with Intel® Coffee Lake S/Refresh 8th/9th-Gen Core™/Xeon® desktop CPU, and optional discrete graphics card guarantees the graphic performance, which satisfies with most of the Automated Intelligent (AI) requirement.

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KEY FEATURES:

Intel® Coffee Lake S/Refresh 8th/9th-Gen Core™/Xeon® LGA1151 socket-type CPU
100W power consumption graphics card support
Eight SIM cards + four WWAN modules support
LTE/5G WWAN module support
6 x External SSD for RAID 0, 1, 5, 10
PCle 3.0 x4 NVMe 1.3 high performance SSD support
EN 50155, class OT4 conformity
3 x mini-PCIe + 3 x M.2 socket expansion
Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+

CPU	Support 8th/9th generation Intel® Core™ i7/i5/i3 / Xeon® LGA1151 socket – Intel® Core™ i7-9700TE/i7-8700T, TDP 35W – Intel® Core™ i5-9500TE/i5-8500T, TDP 35W – Intel® Core™ i3-9100TE/i3-8100T, TDP 35W – Intel® Xeon® E-2278GEL, TDP 35W – Intel® Celeron® G4900T, TDP 35W
Chipset	Intel® C246 platform controller hub
Memory	4 x 260-pin 2400MHz DDR4 SO-DMIM sockets up to 32GB/channel (128GB for four channels) ECC memory to support: i3-9100TE/i3-8100T, E-2278GEL, G4900T
Discrete Graphics Card (optional)	NVIDIA® GEFORCE® GTX 1650 SUPER up to 100W, 1280 CUDA® cores, 4GB GDDR6
Video Output	Chipset Intel® UHD graphics 630 1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz 1 x VGA up to 1920 x 1200 @ 60Hz
Storage	6 x 2.5” SATA external SSD (compatible with 9.5mm drive) 1 x mSATA 1 x M.2 2280/2242/2260 Key M socket for SATA 3.0 or PCle 3.0 x4 NVMe 1.3 1 x Removable SD 3.0
Expansion	1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0) 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0), BOM optional full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM 1 x Full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen1/PCIe 3.0 (BOM optional), PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM 3 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2) for LTE/5G NR module with 2 x external SIM
GNSS and On-board Sensor	1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou Optional M8U/M8L modules with dead reckoning available G Sensor (3-axis, 10-bit resolution)
Power over Ethernet	2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE 2-Port LAN 10GbE SFP+ (optional) 4-Port LAN M12 X-coded, 10/100/1000 Mbps, PoE 802.3af/at, max. 60W (optional)
Security	TPM 2.0: Infineon SLB9665TT2.0FW5.62
I/O Interface-Front	12 x LED indicators (including 2 x programmable LED) 1 x HDMI 1.4b 1 x VGA 1 x M12 A-coded connector for 2 x USB2.0 3 x USB 3.1 Gen 2 type A (5V/1A) 1 x USB 3.1 Gen 1 type A (5V/1A) 8 x Externally accessible SIM card sockets with cover 6 x 2.5” removable SSD tray (with locker) 1 x SD with cover 1 x Reset button 1 x Power button 20 x SMA antenna 2 x LAN M12 X-coded, Intel® I210/I219 (support iAMT) 10/100/1000 Mbps 1 x DB9 (AUDIO) for1 x Mic-in, 2 x Line-out 2 x DB9 (COM1/COM2) for full RS232 (isolation) 2 x DB9 (COM3/COM4) for full RS232/422/485 (isolation) 1 x DB15 (CAN/DIO) – 1 x Isolated CANBus 2.0B – 4 x DI and 4 x DO (isolation) – Power in for DIO isolation, 9~48VDC 1 x Waterproof DC input connector with ignition – 24VDC input with 2.5KVDC isolation – 110VDC input with 2.5KVDC isolation
I/O Interface-Rear	4 x Smart fan (swappable) for system cooling
Power Management	Power input 24VDC/110VDC w/ isolation Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software Support S3/S4 suspend mode 0~255 seconds WDT support, setup by software SDK (Windows/Linux) including utility and sample code
Operating System	Windows 10/Linux
Dimensions	483 x 400 x 95 (W x D x H) (mm)
Weight	8.5kg
Operating temperatures	EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (w/ 35W TDP CPU, 100W TDP GPU, industrial SSD) with air flow
Storage temperatures	-40°C~80°C
Relative humidity	90% (non-condensing)
Vibration	2g@5~500 Hz (in operation, SSD) Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposur
Shock	Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Standards/Certifications	CE FCC Class A EN 50155: 2017 – Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes – Interruptions of voltage supply class S1 – Supply change over class C1, C2 – EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 – Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 – Shock and vibration IEC 61373 Class B – Protective coating class PC1 (PC2, by request) EN 45545-2: 2013+A1:2015 (PCB)