• NEXCOM

NEXCOM ATC 3750-6C

NVIDIA® Jetson AGX™ Orin Solution Performance Edge AI Computing

The ATC 3750 is a rugged, compact-size in-vehicle AI-powered computer that features 9~36VDC with IGN control, 6 PoE+ for accessing IP CAM/LiDAR sensors, and rich peripheral ports, USB 3.2, isolation CANBus, RS232, Console, DI/DO, OTG, and HDMI, With the installation of 5G NR, Wi-Fi 5/6 modules, the ATC 3750 can collaborate with CPS for AI model re-training, making it suitable for deployment in sophisticated application such as ADAS/ANPR/AI-aided ITS/Construction, etc.

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KEY FEATURES:

  • Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8) performance
  • Designed with rugged, compact and hybrid cooling solutions
  • 6-port GbE PoE+ for IP CAM/LiDAR sensors, optional 1-port 10GbE
  • HEVC/H.265 hardware DECODE up to 7 x 4K30 performance
  • Wide range operating temperature of -20°C~70°C
  • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
  • 9~36V DC-IN with ignition control & OCP/OVP
  • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.0.2
  • CE/FCC, UKCA, E-mark Certified
Nexcom-ATC-3750-6C-Amplicon-Middle-East
NVIDIA® Jetson AGX™ Orin SOM

32GB 256-bit LPDDR5, 204.8 GB/s (ATC 3750-6C)
– 8 x cores, 2 Cortex-A78AE CPU clusters (4 cores/cluster), 2.2GHz
– 1792 CUDA® cores, 56 Tensor cores, 108 Sparse TOPS, 939 MHz
– 200 INT8 Sparse TOPS
– 2 x NVDLA v2.0 engines: 1.4 GHz, 46 TOPS each (Sparse INT8)
64 GB 256-bit LPDDR5, 204.8 GB/s (ATC 3750-6C-64)
– 12 x cores, 3 Cortex-A78AE CPU clusters (4 cores/cluster), 2.2GHz
– 2048 CUDA® cores, 64 Tensor cores, 170 Sparse TOPS, 1.3GHz
– 275 INT8 Sparse TOPS
– 2 x NVDLA v2.0 engines: 1.6 GHz, 52.5 TOPS each (Sparse INT8)
Video Encode: 2 x 4K60, 4 x 4K30, 8 x 1080p60 (H.265)
Video Decode: 1 x 8K30, 3 x 4K60, 6 x 4K30, 12 x 1080p60 (H.265)
OpenGL 4.6+, OpenGL ES 3.2, and Vulkan 1.2+, CUDA 10.2+
NVIDIA® JetPack 5.0.2

Chipset

Memory

Storage

64GB eMMC 5.1 flash storage, 200 MHz (HS400 or HS533)
1 x Accessible SD card (SDXC-I/ UHS-I, SD3.0)
1 x M.2 2280 Key M (PCIe4.0 x4), NVMe SSD

Expansion

1 x Full size mPCIe socket (PCIe 4.0, USB 2.0)
1 x M.2 3042/3052 Key B socket (USB 3.2/2.0), 2 x Nano SIM slots
1 x M.2 3030 Key E socket (PCIe 4.0, USB 2.0) for Wi-Fi 5/6

Display

1 x HDMI 2.0A/B, up to 3840 x 2160@60Hz

G-Sensor

3D accelerometer and 3D gyroscope, ST LSM6DSLTR

GbE

PoE+

6-port GbE, RJ45 connector
– 9Kbyte Jumbo frame
– IEEE 802.3 AF/, total 80W, total 80W
– IEEE1588 supported
– PSE ON/OFF & Watt monitoring
– GIGA LAN SWITCH: KSZ9477STXI

USB

2 x USB 3.2 Gen 2:
– Host Type-A connector
– 5V@900mA each
– Up to 10Gbit/s link speed & compliance with USB 2.0 (LS/FS/HS link speed)
1 x OTG, micro-USB

Serial Port

2 x Full RS232 (DB9)
1 x Console (Tx, Rx)
RS232 working voltage, ±9V, baud rate up to 115.2kb/s

DI/DO

4-bit input
– Source: 9~36VDC (12V@1.1mA/24V@2.2mA)
– External: 0~33VDC pull-high, high-level, 3.3-33 VDC; low-level, 0-2 VDC
4-bit output
– Source: 9~36VDC (nominal 35mA@24V)
– External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)
Source or external can be selected by software (default: source type)

CANBus

2 x CAN 2.0A/2.0B
IEC 61000-4-2 Electrostatic Discharge (ESD): ± 8KV/15KV (contact/air)
2.5KV isolated

GNSS

u-blox NEO-M9N GNSS module for GPS/Gloness/QZSS/Galileo/Beidou
Optional DR (Dead Reckoning) function, NEO-M9V/M8L

Power Supply

Nominal voltage: 9~36V
Cranking voltage: 6V~9V (less than 20 sec)
OCP & UVP (shut down once exceeding 37V)
Ignition on/off control & programmable on/off delay timer
Optional for remote power on/off control

I/O Ports, Front-Plate

ATX power button
Reset button
12 x LED Indicators
2 x USB3.2 Type A
Console (DB9)
2 x CAN (DB9)
COM1/RS232 (DB9)
2 x Nano SIMs
1 x HDMI
1 x SD
1 x OTG

I/O Ports, Rear-Plate

COM2/RS232 (DB9)
6x RJ45 (GbE PoE+)
1 x Multi (DI/DO, DR signal)
1 x SMA for GNSS
2 x RP-SMA for Wi-Fi
4 x SMA for LTE/5G
9~36V DC-IN

I/O Ports, Side-Plate

Operating System

NEXCOM Aided Linux (NAL) w/ Jetpack 5.0.2 integrated
NEXCOM custom functions (GNSS, 5G/NR, 6-axis sensor, MCU control)
Ubuntu 20.04 (L4T 35.1, Linux Kernel 5.10)

Dimensions

234.0mm x 172.8mm x 80.5mm (w/ mount bracket)
234.0mm x 184.5mm x 103.6mm (w/ the extractor fan kit, w/ mount bracket)

Weight

w/ mount bracket: weight: 3.5kg
w/ the extractor fan kit, w/ mount bracket: weight: 4.2kg

Operating temperatures

-20°C~70°C (TDP 15W~60W, fanless, w/ 80W PoE)
-20°C~70°C (TDP 50W/60W, w/ 80W PoE, w/ fan kit)

Storage temperatures

-40°C~85°C

Relative humidity

10%~95% (non-condensing)

Vibration

Vibration in operating:
– MIL-STD-810H, 514.8C Procedure 6, Category 4
– IEC 60068-2-64: 2.0g@5~500 Hz
Vibration in storage:
– MIL-STD-810G, 514.6E Procedure 1, Category 24, 7.7g

Shock

MIL-STD-810G, 516.6 Procedure I, trucks and semi-trailers=40g
Crash hazard: Procedure V, ground equipment=75g

Standards/Certifications

CE approval, FCC Class A, UKCA, E13 Certified

Data Sheet

Download / View