Amplicon Middle East-Nexcom-nROK 7252-AC8S
  • NEXCOM

NEXCOM nROK 7252-AC8S

Fanless Rolling Stock Computer with Intel® 8th/9th Gen Core™/Xeon® CPU

NEXCOM system nROK 7252 accomplishes operational efficiency of public transportation and service. Based on Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU and 8-port 802.3 af/at PoE, it provides an integrated solution incorporating high computing power. with dual SIM cards per modem support, it allows six SIM cards to backup each other for a better connectivity quality by software. In addition, six SIM cards and three WWAN modules architecture can increase the bandwidth for a faster data transmission speed. RAID 0, 1, 5, 10 guarantees the safety of data in the 4 x external SSD. nROK 7252 keeps the flexibility to meet the demand for different rolling stock applications, such as infotainment, transportation cellular router, video server, and video surveillance.

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KEY FEATURES:

  • Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU
  • Six SIM cards + three WWAN modules support
  • LTE/5G WWAN module support
  • 4 x External SSD for RAID 0, 1, 5, 10 (compatible with 15mm disk)
  • 2 x mSATA (occupied mini-PCIe slot)
  • EN 50155, class OT4 conformity
  • Three video outputs, one VGA and two HDMI
  • 3 x mini-PCIe + 2 x M.2 socket expansion
  • 1 x SD card for exporting and backing up data
Amplicon Middle East-Nexcom-nROK 7252-AC8S
CPU

Support 9th/8th generation Intel® Core™ i7/i5/i3, Xeon® LGA1151 socket
– Intel® Core™ i7-9700TE/i7-8700T, TDP 35W
– Intel® Core™ i5-9500TE/i5-8500T, TDP 35W
– Intel® Core™ i3-9100TE/i3-8100T, TDP 35W
– Intel® Xeon® E-2278GEL, TDP 35W
– Intel® Celeron® G4900T, TDP 35W
– Intel® C246 platform controller hub
Memory

2 x 260-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels)
ECC memory to support: i3-9100TE/i3-8100T, E-2278GEL, G4900T
Video Output

Chipset Intel® UHD graphics 630
2 x HDMI 1.4b up to 4096 x 2160 @ 30Hz
1 x VGA up to 1920 x 1200 @ 60Hz
Storage

4 x 2.5” SATA 3.0 external SSD (15mm)
2 x mSATA (occupied mini-PCIe slot)
1 x Removable SD 3.0
Expansion

1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA)
1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA), BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.1 Gen 1) for LTE/5G NR module with 2 x external SIM
1 x Full size mini-PCIe socket (USB 2.0, USB 3.1 Gen 2 (BOM optional)) for LTE module, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM
2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM
Function

–
GNSS and On Board Sensor

1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou
Optional M8U modules with dead reckoning available
G Sensor (3-axis, 10-bit resolution)
LAN

2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE
8-Port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W
Security

TPM 2.0: Infineon SLB9665TT2.0FW5.62 (BOM optional)
I/O Interface-Front

24 x LED indicators (including 3 x programmable LED)
2 x HDMI 1.4b
1 x VGA
1 x USB 3.1 Gen 2 type A (5V/1A)
1 x USB 3.1 Gen 1 type A (5V/1A)
6 x Externally accessible SIM card sockets with cover
4 x 2.5” removable SSD tray
1 x SD with cover
1 x Reset button
1 x Power button
10 x SMA antenna
I/O Interface-Rear

2 x LAN M12 X-coded, I210/I219 10/100/1000 Mbps
8 x PoE 802.3af/at (max. 60W), M12 X-coded
1 x Mic-in, 2 x Line-out (AUDIO, DB9, female)
1 x M12 A-coded connector for 2 x USB 2.0
2 x USB 3.1 (5V/1A) type A
2 x DB9 (COM1/COM2) for full RS232 (isolation)
1 x DB9 (COM3) for full RS232/422/485 (isolation)
1 x DB15 (CAN/DIO)
– 1 x Isolated CANBus 2.0B
– 4 x DI and 4 x DO (isolation)
– Power in for DIO isolation, 9~48VDC
1 x Waterproof DC input connector with ignition
– DC 24V/36V (w/o isolation)
3 x SMA antenna
Power Management

power input 24VDC/36VDC w/o isolation
Selectable boot-up & shut-down voltage for low power protection by software
Setting 8-level power on/off delay time by software
Support S3/S4 suspend mode
10~255 seconds WDT support, setup by software
SDK (Windows/Linux) including utility and sample code
Operating System

Windows 10/Linux
Dimensions

260 x 266 x 110 (W x D x H) (mm)
Weight

6.8kg
Construction

–
Operating temperatures

EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (w/ industrial SSD) with air flow
Storage temperatures

-40°C to 80°C
Relative humidity

90% (non-condensing)
Vibration

2g@5~500 Hz (in operation, SSD)
– Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
– Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test
Shock

Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Standards/Certifications

CE
FCC Class A
EN 50155: 2017
– Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
– Interruptions of voltage supply class S1
– Supply change over class C1, C2
– EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
– Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
– Shock and vibration IEC 61373 Class B
– Protective coating class PC1 (PC2, by request)
EN 45545-2: 2013+A1:2015

Data Sheet

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