Amplicon Middle East-AMPLICON-LIVELINE-Impact-S-Scalable-Bronze-3106
  • AMPLICON LIVELINE

AMPLICON LIVELINE Impact-S Scalable – Bronze 3106

Impact-S Scalable – Bronze 3106 (8C/8T), 32GB DDR4 RAM, Dual 240GB SSD w/ Server 2016 preinstalled Iss B

The Amplicon Impact-S Scalable has been designed for high compute and storage applications including CCTV, Data Center, Cloud, and scalable VM. The Impact-S scalable is available with 3.5” or 2.5” caddies and comes with 2 hot-swap 2.5” SSDs on the rear for Operating System redundancy ensuring maximum protection and expansion. Provided with an advanced replacement on core system parts, the Impact-S Scalable is perfect for mission-critical applications.

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KEY FEATURES:

  • Xeon Scalable CPUs (single or dual)
  • Up to 3TB RAM
  • Dual redundant OS drives
  • Available high density drive count
  • Native nested RAID support
  • M.2 capability
  • Pre-Installed with Server 2016
Amplicon Middle East-AMPLICON-LIVELINE-Impact-S-Scalable-Bronze-3106
CPU

Single/Dual Intel® Xeon® Scalable “Socket P”
Chipset

Intel® C624
Main memory

Base RAM 32GB ECC DDR4 2666MHz
QPI Links

2
RAID Support

0,1,10,5,50,6,60
Integrated features

IPMI, BMC, SMM
Video

VGA (DB15)
LAN

Dual 10GbE
Disk Capacity

Impact-S S2012:
Front:12 x 3.5” HDD4
Rear:2 x 2.5” xDD5
Impact-S S2024:
Front: 24 x 2.5” xDD5 (support for up to 2 NVMe drives)
Rear: 2 x 2.5” xDD5
Internal [BOTH]: 2 x M.2 (Function Spec TBC)
System Expansion

Default Option (PCIe Rev. 3.0):
7 PCIe x8 slots
1 PCIe x4
Supported Operating System

Server 2016
Linux (call to confirm
Interface/Swiches

Front:
Dual USB 3.0
Power s/w
ID LED
Advanced Technology Support

Intel® Optane™ Memory Supported Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® Remote Management Module Support Yes
Intel® Node Manager Yes
Intel® Quick Resume Technology No
Intel® Quiet System Technology No
Intel® HD Audio Technology No
Intel® Rapid Storage Technology enterprise Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Intel® I/O Acceleration Technology Yes
Intel® Advanced Management Technology Yes
Intel® Server Customization Technology Yes
Intel® Build Assurance Technology Yes
Intel® Efficient Power Technology Yes
Intel® Quiet Thermal Technology Yes
Electromagnetic Compatibility (EMC)

LV Directive 2014/35/EU
EN 60950-1:2006 + A11:2009 + A12:2011 + A1:2010 + A2:2013
EMC Directive 2014/30/EU
EN 55032: 2012 +AC: 2013 (Non-Harmonized)
EN 55024: 2010 (Non-Harmonized)
EN 61000-3-2: 2014
EN 21000-3-3: 2013
Additional declarations
FCC, 47 CFR Part 15, Class A digital device (USA)
IEC 61000-4-2: 2008
IEC 61000-4-3: 2006 with amendment 1:2007 and Amendment 2:2010
IEC 61000-4-4: 2012
IEC 61000-4-5: 2014
IEC 61000-4-6: 2013
IEC 61000-4-8: 2009
IEC 61000-4-11: 2004
Dimensions

430mm x 709.93mm x 87.38mm (16.93" x 27.95" x 3.44")
Operating Temperature

0 to 45°C
Storage Temperature

– 20 to 65°C
Relative Humidity

5 to 90% at 25°C non-condensing