Amplicon Middle East-Nexcom-VTC 6221
  • NEXCOM

NEXCOM VTC 6221

Intel Atom® E3950 Fanless In-Vehicle Computer with E Mark Conformity

VTC 6221, based on Intel® Core™ quad-core processor E3950 (up to 2.0GHz), specifically complies with stringent E mark standards in rugged, fanless, and compact mechanisms. VTC 6221 provides complete communication capability between vehicle and computer with a build-in CAN Bus 2.0B interface. VTC 6221 features rich WLAN and WWAN wireless connectivity. With dual SIM cards per modem support, VTC 6221 allows six SIM cards to backup each other for a better connectivity quality by software. In addition, six SIM cards and three WWAN modules architecture can increase the bandwidth for a faster data transmission speed.

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KEY FEATURES:

  • Intel Atom® processor quad core E3950, up to 2.0GHz
  • Six SIM cards + three WWAN modules support
  • Built-in u-blox-M8 GPS
  • Built-in CAN Bus 2.0B
  • 1 x External storage (compatible with 9mm disk)
  • E mark conformity
  • 3 x mini-PCIe + 2 x M.2 socket expansion
  • Wide voltage input 9~48 VDC
  • Three video outputs, two VGA and one HDMI
  • 1 x Mic-in, 2 x Line-out
Amplicon Middle East-Nexcom-VTC 6221
CPU

Intel Atom® processor E3950, up to 2.0GHz, 12W, 4 core
Memory

1 x 204-pin DDR3L SO-DIMM socket support 1866MHz up to 8GB. default 4GB
Storage

1 x 2.5” SATA 3.0 external SSD (compatible with 9mm drive)
1 x CFast (externally accessible), optional mSATA
Expansion

1 x Full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM
1 x Full size mini-PCIe socket (USB 2.0, PCIe 2.0), BOM optional full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM
1 x Full size mini-PCIe socket (USB 2.0, PCIe 2.0)
1 x M.2 3042 Key B socket (USB 2.0, USB 3.0) for LTE/5G NR module with 2 x external SIM
1 x M.2 3042/3050/3052 Key B (USB 2.0, USB 3.0, PCIe 2.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM
Function

–
I/O Interface-Front

12 x LED indicators (including 2 x programmable LED)
6 x Externally accessible SIM card sockets with cover
1 x 2.5" removable SSD tray
1 x Externally accessible CFast card socket with cover
1 x Reset button
1 x Power button
1 x USB 3.0 type A (5V/0.9A)
8 x SMA antenna
I/O Interface-Rear

1 x 3-pin terminal block for 9V~48 VDC
2 x USB 2.0 type A (5V/0.5A)
2 x RJ45 LAN port, 10/100/1000 Mbps
1 x Mic-in, 2 x Line-out
2 x VGA
1 x HDMI 1.4b
1 x DB9 (COM) full RS232
3 x SMA antenna
1 x DB9 (MULTI PORT) for RS232 TX/RX, RS485, USB 2.0
1 x 18-pin terminal block
– 1 x CAN Bus 2.0B (onboard)
– 4 x DI
– 4 x DO
– Vin, GND for GPIO
Power Management

Power input 9~48 VDC
Selectable boot-up & shut-down voltage for low power protection by software
Setting 8-level power on/off delay time by software
Support S3/S4 suspend mode
10~255 seconds WDT support, setup by software
SDK (Windows/Linux) including utility and sample code
Operating System

Windows 10/Linux
Video Output

Chipset Intel® HD graphics 505
1 x HDMI 1.4b up to 4096 x 2160 @30Hz
2 x VGA up to 1920 x 1200 @60Hz
GNSS and On Board Sensor

1 x Default u-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou
Optional M8U modules with dead reckoning available
G Sensor (3-axis, 10-bit resolution)
LAN

2-Port LAN, 10/100/1000 Mbps I210-IT GbE, BOM optional 3-port LAN
Security

TPM 2.0: Infineon SLB9665TT2.0FW5.62 (BOM optional)
Dimensions

260mm (W) x 196mm (D) x 50mm (H) (10.24” x 7.71” x 1.97”)
Weight

2.5kg
Operating temperatures

-40°C to 70°C (w/ industrial SSD) with air flow
Storage temperatures

-40°C to 80°C
Relative humidity

10% to 90% (non-condensing)
Vibration

2g@5~500 Hz (in operation, SSD)
Shock

Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=20g
– Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Standards/Certifications

CE
FCC Class A
E13 mark

Data Sheet

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