Amplicon Middle East-Nexcom-aROK 8110
  • NEXCOM

NEXCOM aROK 8110

Intel® 8th/9th Gen Core™/Xeon® CPU + Inference Accelerator AI-Powered for Autonomous and Machine Vision

AI has become an essential component of automated vehicle technology. With built-in high-performance Intel® Coffee-Lake S/Refresh, or Xeon® processing power and the powerful NVIDIA® GeForce® RTX 2080 Ti graphics engine with 4,352 CUDA® cores, aROK 8110 can satisfy a wide variety of applications for the rolling stock applications, such as track obstacle inspection, traffic light, traffic sign recognition, pantograph inspection and highly-demanding on graphic performance.

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KEY FEATURES:

  • Rolling stock AI recognition and machine vision applications
  • Up to 8-core Intel® 8th/9th Gen Core™/Xeon® CPU processing power
  • 4 x PCIe 3.0 slots for discrete graphics/inference/frame grabber cards
  • Ultra-fast NVMe M.2/U.2 media for high-speed multi-cameras image capture
  • RAID 0/1/5/10 configurable for data secure and integrity
  • 24/36 VDC input with ignition management
  • Special fixture design avoids vibration issues with GPU and PCIe cards
  • Functionality of WWAN/5G NR, WLAN and GNSS with up to 4 SIM slots
  • Compliant with EN 50155 OT4 and MIL-STD-810G for anti-vibration/shock w/ graphics card and PCIe card installed
  • Smart fan design with temperature-based RPMs
Amplicon Middle East-Nexcom-aROK 8110
CPU

Intel® Coffee-Lake S/Refresh Core™/Xeon® i7/i5/i3/Pentium®/Celeron® processor (LGA1151)
Intel® chipset C246
Memory

Two 260-pin DDR4 SO-DMIM sockets
Up to 32GB+32GB in size, 2400/2666 MHz
ECC memory to support: i3-8100/8100T, i3-9100T/9100TE, E-2124G, E-2278GE/2278GEL, G5400/5400T, G4900/4900
Video Output

–
Storage

4 x 2.5” SATA 3.0 SSD/HDD (15mm height), or 3 x 2.5” SATA 3.0 SSD/HDD + 2 x M.2 2242/2260/2280 Key M NVMe SSD (PCIe 3.0 x2), or 3 x 2.5” SATA 3.0 SSD/HDD + 1 x U.2 NVMe SSD (PCIe 3.0 x2)
1 x CFast (externally accessible)
Expansion

1 x Full size mPCIe socket (USB 2.0, PCIe 3.0)
1 x Full size mPCIe socket (USB 2.0) for LTE module, BOM optional M.2 3042 Key B socket (USB 2.0) for LTE module with 1 x external, 1 x internal SIM
1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 1 x external, 1 x internal SIM
1 x PCIe 3.0 x16 slot for discrete graphics card, up to 321mm in length
3 x PCIe 3.0 x4 slot, up to 240mm in length
Function

–
GNSS and On Board Sensor

1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou
Optional modules with dead reckoning available
Built-in G-sensor
LAN

2-Port independent GbE LAN, M12 X-coded
9K byte jumbo frame
PTP (IEEE 1588) support
Controller: Intel® i210-T1, PHY: Intel® I219LM
vPro (iAMT) & WOL support
Security

TPM 2.0: Infineon SLB9660TT1.2-FW4.40 (BOM optional)
I/O Interface-Front

Waterproof DC input connector with ignition for 24/36 VDC-IN
Power button
Reset button
6 x LED indicators for power/IGN/WLAN/WWAN/LAN status
4 x LED indicators for storage/fan control
5 x LED indicators for user to program
1 x USB 3.1 Gen2 + 1 x USB 2.0, type A
1 x DB15 (CAN/DIO, 4 x DI/4 x DO + 1 x CAN 2.0B)
1 x DB15 (EXT.), reserved for expansion (or DB9 for DR signal)
7 x SMA antenna holes
2 x DB9 (COM3/COM4) for RS232/RS422/RS485 selectable (isolation)
I/O Interface-Rear

2 x USB 3.1 Gen2, type A
1 x M12 A-coded connector for 2 x USB 2.0
2 x GbE (M12 X-coded)
1 x VGA + 1 x HDMI
2 x DB9 (COM1/COM2) for RS232/RS422/RS485 selectable (isolation)
2 x SIM slots
1 x SMA antenna hole for GNSS
6 x SMA antenna holes
1 x PCIe x16 lane slot
3 x PCIe x4 lane slots
1 x DB9 (AUDIO, female) for 1 x Mic-in (stereo), 2 x Line-out (stereo)
Power Management

24/36 VDC-IN
Cranking voltage: 6V~9V (< 30 seconds)
Reverse protection, OCP & UVP
Ignition on/off control/programmable on/off delay timer
Display

1 x VGA port, up to 1920 x 1200@60Hz
1 x HDMI v1.4, up to 4096 x 2160@30Hz
DI/DO (isolation)

4-Bit input
– Source: 9~48V-IN (12V@1.1mA/24V@2.2mA)
– External: 0~33VDC pull-high, high-level, 3.3 – 33 VDC; low-level, 0-2 VDC
4-Bit output
– Source: 9~48V-IN (nominal 35mA@24V)
– External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)
Source or external can be selected by software (default: source type)
Fan

1 x CPU fan
1 x System fan
CAN 2.0B (isolation)

CAN 2.0B (isolation)
Controller: SJA1000
Bit rate up to 1Mbit/s
Socket CAN supported
11-bit & 29-bit identifiers, ISO 11898-1, ISO 11898-2
ESD: ± 8KV/15KV (contact/air)
2.5KV isolated
Operating System

Windows 10/Linux
Dimensions

215 x 205 x 385 (W x D x H) (mm)
Weight

10.5 kg
Construction

–
Operating temperatures

EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (w/ 35W TDP CPU, industrial SSD) with air flow
Storage temperatures

-40°C~85°C
Relative humidity

10%~95% (non-condensing)
Vibration

– IEC 60068-2-64 1.0g@5~500Hz (in operating, HDD), 1.6g for HDD w/ damping brackets
– IEC 60068-2-64 2.0g@5~500Hz (in operating, SSD + graphics card)
– Operating: MIL-STD-810G, 514.6C, category 4
– Storage: MIL-STD-810G, 514.6, category 24, minimum integrity test
Shock

Operating: MIL-STD-810G, Method 516.6, procedure I, functional shock=40g
Non-operating: MIL-STD-810G, Method 516.6, procedure V, crash hazard shock test=75g
Standards/Certifications

CE
FCC Class A
EN 50155: 2017
– Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
– Interruptions of voltage supply class S1
– Supply change over class C1, C2
– EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
– Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
– Shock and vibration IEC 61373 Class B
– Protective coating class PC1 (PC2, by request)
EN 45545-2: 2013+A1:2015

Data Sheet

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